C L I E N T S
Partial Listing of Companies and Work Performed:
- Advanced Storage Systems - Stress and deflection on rail
members.
- APS Systems - Structural analysis on composite bus
structure and frame.
- Aquatec - Non-Linear analysis on pump diaphragm.
- B/E Aerospace - CFD/Thermal analysis on VC structure.
- Capstone - Structural, Thermal and Fluid analysis on
turbine components.
- Chadwick Associates - Stress and deflection analysis on
cast aluminum frame for injected molded bench.
- Condor Pacific - stress and deflection analysis on Gyro
components.
- Eaton Corp. - Thermal analysis on valve assembly.
- Emerson Johnson and Mackay Inc.- Stress analysis on shelf
components.
- Express Cad Engineering - Sub contract FEA work
- General Dynamics Electronics Division - Flow analysis of
electronic board cooling.
- Genesis Design - structural and dynamic analysis on
gyroscope mechanism.
- G/G Industries - Structural analysis on plastic molded
components.
- Holga - Structural analysis of steel cabinets using
Pro/Engineer.
- International Rectefire - Thermal analysis of
semi-conductor amplifier
- Johnson Design - Stress analysis on ACAD and Pro/E models.
- ITT Aerospace Controls - Stress and vibration analysis on
valve components and assemblies.
- Lester Creative – Structural analysis on the MGM lion
- Marconi Dynamics - Non-linear drop test of missile crate.
- Maritech - Stress analysis on ship immersed and deck body
frame.
- Minzlaff Design Services - Thermal/Dynamic analysis on
electronic assembly.
- RainBird - Stress analysis on valve components
- Rantech - Dynamic analysis on microwave antennas in
satellites.
- Rockwell Collins - Frequency analysis on VCC structure
- Rosen Motors - Structural analysis of axisymetric rotors
- SeaQuest - Stress analysis of BackPack design.
- ShurFlo - Stress analysis on pump components.
- Sloan Technology- Stress analysis on measurement device
models.
- STADCO - Structural analysis on molding machine
components.
- Thermoscan - Stress analysis simulating drop test for
electronic board and sensor.
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